Place of Origin: | China |
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Brand Name: | UNICOMP |
Certification: | CE, FDA |
Model Number: | AX8300 |
Name: | X-ray Inspection Machine | Industry: | Electronics Industry |
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Size: | 1100(L)x1100(W)x1650(H)mm | X-ray Leakage: | < 1uSv/h |
Weight: | 1500kg | Power Consumption: | 1.5KW |
SMD Cable Electronics Components Unicomp X-ray Detector AX8300
Model | AX8300 |
Max kV/type | 110 kV(Option90 kV)/Sealed |
Max.Electron beam power | 25W(Option8W) |
Focal spot size1 | 7μm |
System magnification | Up to 1000X |
Imaging system(Option) | Flat Panel Detector |
Manipulator | 8-axis with tilt 50 degree |
Measuring volume | Max load area 300x300mm2 |
Max.sample weight | 5kg |
Monitors | 22″ LCD |
Cabinet dimensions | 1100x1100x1650mm |
Weight | 1700kg |
Radiation safety2 | <1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm |
Control | Keyboard/Mouse/Joystick |
Automated inspection | Standard |
Primary applications | Chip inspection/Electronic components/Auto parts.etc |
1.Focal spot size is a variable.Please consult the unicomp 2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2″from any external surface.Our machines are typically 15times less emission. |
Applications
Solder reflow analysis
BGA connectivity and analysis
Solder void calculation
Through hole measurement and inspection
Die attach voiding measurement
Ball bond analysis
Stitch bond analysis
Micro BGA / chip on chop analysis
Pad array analysis
Dry joint detection and analysis
Object Stage Control
1. by the spacebar to adjust stage speed: slow, constant and fast speed
2. Keyboard control X, Y, Z three-axis motion and inclined angle
3. The user can control the stage speed and angle programmatically
Inspection Images: