Place of Origin: | China |
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Brand Name: | UNICOMP |
Certification: | CE, FDA |
Model Number: | AX7900 |
Name: | Unicomp Metal X Ray Machine | Intensifier: | FPD |
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Monitor: | 22 ‘’LCD | System Magnification: | 160 X/360X |
Max.Loading Size: | 440mm X 400mm | X-ray Leakage: | < 1uSv/h |
Metal X Ray Machine 80kV / 90kV source with submicron focal spot size
FEATURES:
90KV 5μm X-ray tube, FPD Detector.
Multi-function workstation, X-Y multi-axis movement. ±60° “Arc” motion(Option).
Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion
(option).
Multi-function DXI image processing system.
X/Y programming function for multiple image inspection routines
Max. loading area 420mm x 420mm, max. detection area 380 x 380mm, with ~300X System Magnification.
BGA void/area auto-measurement plus report generation.
Item | Definition | Specs |
System Parameters | Size | 1100(L)x1100(W)x1500(H)mm |
Weight | 1000kg | |
Power | 220AC/50Hz | |
Power Consumption | 0.8kW | |
X-ray Tube | Type | Closed |
Max.Voltage | 80kV/90kV | |
Max.Power | 12W/8W | |
Spot Size | 5μm/15μm | |
X-ray System | Intensifier | FPD |
Monitor | 22 ‘’LCD | |
System Magnification | 160 X/360X | |
Detection Region | Max.Loading Size | 440mm x 400mm |
Max.Inspection Area | 420mm x 380mm | |
X-ray Leakage | <1μSv/h |
Benefits
Flexibility combined in one system
Interactive visualization
Fully automatic X-ray inspection
Low-cost maintenance with open-tube technology
Safe system requiring no special precautions or badges
Small footprint
Product Application
X ray testing equipment pcb x-ray machine system have enabled fabricators of multi-layer PCBs to enhance product quality and control cost. The detection of high-definition video make you find out the joints open, short, voids and other defects at a glance.
X-ray inspection enables users to control cost by eliminating defective board early in the production process.
X-ray inspection system has been widely applied to Circuit Board Inspection, Semi-Conductor Inspection and Other Applications.
1.Semiconductor package
2.Electronic connector module
3.Die Casting
4.Cars
5.Battery
6.LED
7.PCB’A
8.Other application(BGA Inspection BGA, Semiconductor, Inspection of over molded electrical connectors, Encapsulated components, Aluminum die castings, Molded plastic components , Ceramics, Aerospace components, Electrical / mechanical components, Pharmaceuticals, Automotive assemblies, Agriculture (Seed inspection)